产品简介
DECAN系列可帖贴装元器件范围很大，能以多样化的PCB移送系统大幅提高产能。
· 确保了适合各种作业的元器件处理能力及输送机的灵活性
· 通过Motion Sequence的优化及设备之间共享数据而缩短了生产时间
· 通过适用立体照明系及改善强视觉算法增强了异型元器件识别能力。
· 通过Motion Sequence的优化及设备之间共享数据而缩短了生产时间
· 通过适用立体照明系及改善强视觉算法增强了异型元器件识别能力。
Specifications
| DECAN S2 | DECAN F2 | DECAN L2 | |||
|---|---|---|---|---|---|
| Alignment | Fly Camera + Fix Camera (Option) | ||||
| The Number of Spindles | 10 Spindle x 2 Gantry | 10 Spindle x 2 Gantry | 6 Spindle x 2 Gantry | ||
| Placement Speed (Optimum) | 92,000 CPH (Optimum) | 80,000 CPH (Optimum) | 56,000 CPH (Optimum) | ||
| Placement Accuracy | Chip | ±28 μm @ Cpk ≥ 1.0 (03015 Chip) | ±40 μm @ Cpk ≥ 1.0 | ||
| IC | ±30 μm @ Cpk ≥ 1.0 | ||||
| Component Range | Fly Camera | 03015 ~ □12 mm | 0402 ~ □16 mm | 0402 ~ □21 mm | |
| Fix Camera | ~□42 mm (Standard) ~□55 mm (MFOV) ~ L75 mm Connector (MFOV) | ||||
| Max. Height | 10 mm (Fly) 15 mm (Fix) | 12 mm (Fly) 25 mm (Fix) | |||
| PCB Size (mm) | Min. | L50 x W40 | |||
| Max. | Single Lane | ~ L510 x W460 (Standard) ~ L1,200 x W460 (Option) ~ L1,500 x W460 (Option) |
|||
| Dual Lane | ~ L510 x W250 (Standard) ~ L510 x W280 (Option) ~ L1,200 x W250 (Option) | ~ L510 x W250 (Standard) ~ L1,200 x W250 (Option) |
|||
| PCB Thickness (mm) | 0.38 ~ 4.2 | ||||
| Feeder Capacity (8 mm 基准) | 120 ea / 112 ea (Docking Cart) | ||||
| Utility | power | 3 Phase, AC 200 / 208 / 220 / 240 / 380 / 415V ±10% (50/60 Hz) Max. 5.0 kVA |
|||
| Air Consumption | 5.0 ~ 7.0 kgf/cm2 50 Nℓ/min |
||||
| Weight (kg) | Approx. 1,800 | ||||
| External Dimension (mm) | L1,430 x D1,740 x H1,485 | ||||
