产品简介
DECAN系列设备可贴装元器件广泛很广，且多样化的PCB移送系统大幅提高产能。
· 确保了多种元器件处理能力及输送的灵活性
· 通过Motion Sequence的优化及设备之间共享数据缩短了生产时间
· 通过使用立体照明系统及改善强视觉算法增强了异型元器件识别能力。
· 通过Motion Sequence的优化及设备之间共享数据缩短了生产时间
· 通过使用立体照明系统及改善强视觉算法增强了异型元器件识别能力。
Specifications
| DECAN S2 | DECAN F2 | DECAN L2 | |||
|---|---|---|---|---|---|
| Alignment | Fly Camera + Fix Camera (Option) | ||||
| The Number of Spindles | 10 Spindle x 2 Gantry | 10 Spindle x 2 Gantry | 6 Spindle x 2 Gantry | ||
| Placement Speed (Optimum) | 92,000 CPH (Optimum) | 80,000 CPH (Optimum) | 56,000 CPH (Optimum) | ||
| Placement Accuracy | Chip | ±28 μm @ Cpk ≥ 1.0 (03015 Chip) | ±40 μm @ Cpk ≥ 1.0 | ||
| IC | ±30 μm @ Cpk ≥ 1.0 | ||||
| Component Range | Fly Camera | 03015 ~ □12 mm | 0402 ~ □16 mm | 0402 ~ □21 mm | |
| Fix Camera | ~□42 mm (Standard) ~□55 mm (MFOV) ~ L75 mm Connector (MFOV) | ||||
| Max. Height | 10 mm (Fly) 15 mm (Fix) | 12 mm (Fly) 25 mm (Fix) | |||
| PCB Size (mm) | Min. | L50 x W40 | |||
| Max. | Single Lane | ~ L510 x W460 (Standard) ~ L1,200 x W460 (Option) ~ L1,500 x W460 (Option) |
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| Dual Lane | ~ L510 x W250 (Standard) ~ L510 x W280 (Option) ~ L1,200 x W250 (Option) | ~ L510 x W250 (Standard) ~ L1,200 x W250 (Option) |
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| PCB Thickness (mm) | 0.38 ~ 4.2 | ||||
| Feeder Capacity (8 mm 基准) | 120 ea / 112 ea (Docking Cart) | ||||
| Utility | power | 3 Phase, AC 200 / 208 / 220 / 240 / 380 / 415V ±10% (50/60 Hz) Max. 5.0 kVA |
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| Air Consumption | 5.0 ~ 7.0 kgf/cm2 50 Nℓ/min |
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| Weight (kg) | Approx. 1,800 | ||||
| External Dimension (mm) | L1,430 x D1,740 x H1,485 | ||||
