High Speed Model for Max. Productivity
UPH | Max. 15,000 | |
Placement Accuracy | ±5 μm @ 3σ | |
Substrate | Width | Max. 330mm (166mm @Dual Lane) |
Length | Max. 330mm | |
Thickness | 0.22 ~ 4.0mm | |
Die | Size | □1.5 ~ □12mm (~□46mm Option) |
Thickness | 0.04 ~ 3.0mm | |
Die Supply | Wafer | 8 ~ 12 inch |
Bump | Pitch | Min. 45 μm |
Diameter | 33 ~ 500 μm | |
Height | 30 ~ 500 μm | |
Flux | Thickness | Min. 5 μm |
Fluxing Accuracy | ±2 μm | |
Bond Force | 0.5~30N | |
Utility | Electric | AC200/208/220/240/380/415V ±10%: 50/60Hz, 3Phase/3Wire |
Power Consumption | Max. 4.3kVA | |
Compressed Air | 0.6 MPa (6 bar)/87 Psi : Consumption < 100 NI/min | |
Vacuum | -0.085 MPa (-0.85 bar)/635 mmHg, Average < 50 NI/h, Peak 100 NI/h | |
Dimension (mm) | W1,811 x D1,623 x H1,889 |