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产品简介

SFM5

Next Generation Smart Flip Chip Machine

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High Speed Model for Max. Productivity

· Ultra High Speed UPH (Max. 15K)
· Dual Lane Conveyor & Automation
· In-line setup available with multi units


Specifications

Specifications

UPH Max. 15,000
Placement Accuracy ±5 μm @ 3σ
SubstrateWidthMax. 330mm (166mm @Dual Lane)
LengthMax. 330mm
Thickness0.22 ~ 4.0mm
DieSize□1.5 ~ □12mm (~□46mm Option)
Thickness0.04 ~ 3.0mm
Die SupplyWafer8 ~ 12 inch
BumpPitchMin. 45 μm
Diameter33 ~ 500 μm
Height30 ~ 500 μm
FluxThicknessMin. 5 μm
Fluxing Accuracy±2 μm
Bond Force 0.5~30N
UtilityElectricAC200/208/220/240/380/415V ±10%: 50/60Hz, 3Phase/3Wire
Power ConsumptionMax. 4.3kVA
Compressed Air0.6 MPa (6 bar)/87 Psi : Consumption < 100 NI/min
Vacuum-0.085 MPa (-0.85 bar)/635 mmHg,
Average < 50 NI/h, Peak 100 NI/h
Dimension (mm) W1,811 x D1,623 x H1,889


Features


    Specifications

    Specifications


    Features


      Specifications

      Specifications


      Features


        Specifications

        Specifications


        Features