제품소개
Smart Die Bonder
- High accuracy(±5um) & productivity (4head)
- Unique thin die pick-up system
- Auto Tilt adjust module (Full-auto conversion)
- Auto Inspection system for Particle and Dust
- Customized software options and SECS/GEM interface
- Fast on-site response through our extensive service network
- Unique thin die pick-up system
- Auto Tilt adjust module (Full-auto conversion)
- Auto Inspection system for Particle and Dust
- Customized software options and SECS/GEM interface
- Fast on-site response through our extensive service network
Specifications
| Configuration | 4 Head (with 4 Gantry) | |
| Bonding Method | DAF Bonding | |
| Accuracy | ±5 μm @ 3σ | |
| Productivity (UPH) | Max. 6.0K (DRAM) | |
| Chip / Die | Size | □ 1.0 ~ 25 mm |
| Thickness | 0.02 ~ 0.25 mm | |
| Wafer Size | Max. 12 inch | |
| Substrate / Leadframe size | Width | 60 ~ 95 mm |
| Length | 240 mm (Customizable) | |
| Thickness | 0.07 ~ 1.0 mm | |
| Options | Thin-Die Kit | Thin Die Min. Thickness 20 |
| Bond Head | Auto-Tilt Adjustment | |
| Factory Automation | Overhead Hoist Transfer (OHT) | |
| Tool Change | Auto Dome, Collet Change | |
| Utilities | Power Supply | 200~480V AC ±10%, 50/60Hz, 3Phase/4Wire |
| Power Consumption | Max. 10kVA (Max. 27A), Breaker Capa. 50A | |
| Air | 0.5 MPa, 100 NI/min | |
| Vacuum | -0.085 Mpa | |
| Dimensions | 3,050 x 1,650 x 1,800 (Dual, OHT) | |
| 2,800 x 1,450 x 1,800 (Single, Non-OHT) | ||