High Speed Model for Max. Productivity
| UPH | Max. 15,000 | |
| Placement Accuracy | ±5 μm @ 3σ | |
| Substrate | Width | Max. 330mm (166mm @Dual Lane) |
| Length | Max. 330mm | |
| Thickness | 0.22 ~ 4.0mm | |
| Die | Size | □1.5 ~ □12mm (~□46mm Option) |
| Thickness | 0.04 ~ 3.0mm | |
| Die Supply | Wafer | 8 ~ 12 inch |
| Bump | Pitch | Min. 45 μm |
| Diameter | 33 ~ 500 μm | |
| Height | 30 ~ 500 μm | |
| Flux | Thickness | Min. 5 μm |
| Fluxing Accuracy | ±2 μm | |
| Bond Force | 0.5~30N | |
| Utility | Electric | AC200/208/220/240/380/415V ±10%: 50/60Hz, 3Phase/3Wire |
| Power Consumption | Max. 4.3kVA | |
| Compressed Air | 0.6 MPa (6 bar)/87 Psi : Consumption < 100 NI/min | |
| Vacuum | -0.085 MPa (-0.85 bar)/635 mmHg, Average < 50 NI/h, Peak 100 NI/h | |
| Dimension (mm) | W1,811 x D1,623 x H1,889 |
