제품소개

SDB-1

Smart Die Bonder

SDB1_R.jpg

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Smart Die Bonder

- High accuracy(±5um) & productivity (4head)
- Unique thin die pick-up system
- Auto Tilt adjust module (Full-auto conversion)
- Auto Inspection system for Particle and Dust
- Customized software options and SECS/GEM interface
- Fast on-site response through our extensive service network


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Specifications

Configuration 4 Head (with 4 Gantry)
Bonding Method  DAF Bonding
Accuracy ±5 μm @ 3σ
Productivity (UPH)  Max. 6.0K (DRAM)
Chip / Die Size □ 1.0 ~ 25 mm
Thickness 0.02 ~ 0.25 mm
Wafer Size  Max. 12 inch
Substrate / Leadframe size Width 60 ~ 95 mm
Length 240 mm (Customizable)
Thickness 0.07 ~ 1.0 mm
Options Thin-Die Kit Thin Die Min. Thickness 20
Bond Head Auto-Tilt Adjustment
Factory Automation Overhead Hoist Transfer (OHT)
Tool Change Auto Dome, Collet Change
Utilities Power Supply 200~480V AC ±10%, 50/60Hz, 3Phase/4Wire
Power Consumption Max. 10kVA (Max. 27A), Breaker Capa. 50A
Air 0.5 MPa, 100 NI/min
Vacuum -0.085 Mpa
Dimensions 3,050 x 1,650 x 1,800 (Dual, OHT)
2,800 x 1,450 x 1,800 (Single, Non-OHT)


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