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Product

DECAN S2

Advanced Chip Shooter

Inquiry

The DECAN series models can handle a wide range of components and maximize productivity with various PCB transfer systems.

· Secures the applicability to components and conveyor flexibility.
· Reduces production time by optimizing the motion sequence.
· Reinforces odd-shape component recognition by applying 3D lighting system.


Specifications

Specifications

  DECAN S2 DECAN F2DECAN L2
Alignment  Fly Camera + Fix Camera (Option)  
The Number of Spindles10 Spindle x 2 Gantry 10 Spindle x 2 Gantry6 Spindle x 2 Gantry
Placement Speed
(Optimum)
92,000 CPH (Optimum) 80,000 CPH (Optimum) 56,000 CPH (Optimum)
Placement
Accuracy
Chip ±28 μm @ Cpk ≥ 1.0
(03015 Chip)
±40 μm @ Cpk ≥ 1.0
IC ±30 μm @ Cpk ≥ 1.0
Component
Range
Fly Camera 03015 ~ □12 mm 0402 ~ □16 mm 0402 ~ □21 mm
Fix Camera ~□42 mm (Standard)
~□55 mm (MFOV)
~ L75 mm Connector (MFOV)
Max. Height 10 mm (Fly) 15 mm (Fix) 12 mm (Fly) 25 mm (Fix)
PCB Size (mm) Min. L50 x W40
Max.Single Lane ~ L510 x W460 (Standard)
~ L1,200 x W460 (Option)
~ L1,500 x W460 (Option)
Dual Lane~ L510 x W250 (Standard)
~ L510 x W280 (Option)
~ L1,200 x W250 (Option)
~ L510 x W250 (Standard)
~ L1,200 x W250 (Option)
PCB Thickness (mm) 0.38 ~ 4.2
Feeder Capacity
(8 mm standard)
120 ea / 112 ea (Docking Cart)
Utility power 3 Phase, AC 200 / 208 / 220 / 240 / 380 / 415V ±10% (50/60 Hz)
Max. 5.0 kVA
Air
Consumption
5.0 ~ 7.0 kgf/cm2
50 Nℓ/min
Weight (kg) Approx. 1,800
External Dimension (mm) L1,430 x D1,740 x H1,485

Features