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Semiconductor

Semiconductor front-end process includes patterning of circuits and creating wafers. The back-end includes packaging of wafers and tests. Hanwha Precision Machinery conducts business in both front and back-end with depositioning and packaging. We work with our global IDM (Integrated Device Manufacturer) and various OSAT (Out-sourced Semiconductor Assembly And Test) customers to create the world-class semiconductor equipments.
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    SDB-1

    Smart Die Bonder