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제품소개

SFM5

Next Generation Smart Flip Chip Machine

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High Speed Model for Max. Productivity

· Ultra High Speed UPH (Max. 15K)
· Dual Lane Conveyor & Automation
· In-line setup available with multi units


제품사양

Specifications

UPH   Max. 15,000
Placement Accuracy   ±5 μm @ 3σ
Substrate Width Max. 330mm (166mm @Dual Lane)
Length Max. 330mm
Thickness 0.22 ~ 4.0mm
Die Size □1.5 ~ □12mm (~□46mm Option)
Thickness 0.04 ~ 3.0mm
Die Supply Wafer 8 ~ 12 inch
Bump Pitch Min. 45 μm
Diameter 33 ~ 500 μm
Height 30 ~ 500 μm
Flux Thickness Min. 5 μm
Fluxing Accuracy ±2 μm
Bond Force   0.5~30N
Utility Electric AC200/208/220/240/380/415V ±10%: 50/60Hz, 3Phase/3Wire
Power Consumption Max. 4.3kVA
Compressed Air 0.6 MPa (6 bar)/87 Psi : Consumption < 100 NI/min
Vacuum -0.085 MPa (-0.85 bar)/635 mmHg,
Average < 50 NI/h, Peak 100 NI/h
Dimension(mm)   W1,811 x D1,623 x H1,889

특장점


    제품사양

    Specifications


    특장점


      제품사양

      Specifications


      특장점


        제품사양

        Specifications


        특장점